Driver IC directly bonded on glass no PCB needed, module thickness ≤2.0mm, saving space.
Connects to mainboard via FPC or conductive rubber bendable, fitting tight or irregular spaces.
Only a few external capacitors/resistors needed, simplifying mainboard design and reducing BOM cost.
Supports TN, STN, FSTN modes, positive or negative display to suit various ambient light conditions.
Designed for low power, suitable for coin-cell battery applications like electronic tags and smart cards.
Custom dot-matrix resolutions (e.g., 80×48, 96×32) for simple graphics or small character display.
IC directly bonded to glass – no solder pins, better vibration resistance than plug-in modules.
E-cigarettes, smart locks, remote controls, glucometers, small handheld devices, etc.
